TE0818-02-9BE81-A

TE0818-02-9BE81-A

Part number
TE0818-02-9BE81-A
Product Categories
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Trenz Electronic
Describe
ULTRASOM+ MPSOC MODULE WITH AMD
Encapsulation
-
Package
Bulk
ROHS status
Yes
Price
USD $1,067.9200
Data sheet
-
Quantity
RFQ
In stock: 20000
Smallest : 1
Multiple : 1
Quantity
Unit price
Price
1
$1,067.9200
$1,067.9200
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Purchase and inquiry

Specification

Transport

Data sheet

ABLIC U.S.A. Inc. S-1132B33-I6T2U has similar specifications, properties, parameters and parts as ABLIC U.S.A. Inc. S-1132B33-I6T2U.

TYPEDESCRIPTION
MfrTrenz Electronic
SeriesZynq UltraScale+
PackageBulk
Product StatusACTIVE
Connector TypeBoard-to-Board (BTB) Socket - 4 x 240
Size / Dimension2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size4GB
Operating Temperature0°C ~ 85°C
Module/Board TypeMPU Core
Core ProcessorXilinx Zynq UltraScale+ XCZU9EG-1FFVC900E
Flash Size128MB

Shipping fee


Shipping starts at $40, but can be over $40 for some countries. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
Basic shipping charges (package ≤0.5kg or corresponding volume) depend on time zone and country.


Mailing method


Currently, our products are shipped via DHL, FedEx, SF and UPS.


Delivery time


Once the goods are shipped, the estimated delivery time depends on the shipping method you choose:

FedEx International, 5-7 business days.

The following are logistics times for some common countries.

transport

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